J. Marzouk, S. Arscott, A. El Fellahi, K. Haddadi, T. Lasri, L. Buchaillot, G. Dambrine
{"title":"MEMS-based RF probes for on-wafer microwave characterization of micro/nanoelectronics","authors":"J. Marzouk, S. Arscott, A. El Fellahi, K. Haddadi, T. Lasri, L. Buchaillot, G. Dambrine","doi":"10.1109/MEMSYS.2015.7051133","DOIUrl":null,"url":null,"abstract":"We demonstrate a radio frequency (RF) probe based on microelectromechanical systems (MEMS) design and processing technologies. The probe responds to the current needs of microelectronics requiring microwave characterization of nanoscale devices and systems having micrometer pad sizes. The use of MEMS technologies enables the probe contact pad area dimensions to be reduced by a three orders of magnitude compared to existing commercial RF probes. On-wafer RF measurements prove the feasibility of the approach to 30 GHz at very low contact resistance ≪1 Ω. A contact aging study demonstrates that the probes are capable of forming this contact for 6000 contact cycles.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2015.7051133","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
We demonstrate a radio frequency (RF) probe based on microelectromechanical systems (MEMS) design and processing technologies. The probe responds to the current needs of microelectronics requiring microwave characterization of nanoscale devices and systems having micrometer pad sizes. The use of MEMS technologies enables the probe contact pad area dimensions to be reduced by a three orders of magnitude compared to existing commercial RF probes. On-wafer RF measurements prove the feasibility of the approach to 30 GHz at very low contact resistance ≪1 Ω. A contact aging study demonstrates that the probes are capable of forming this contact for 6000 contact cycles.