Electrical Characterization and Analysis of 4H-SiC Lateral MOSFET (LMOS) for High-Voltage Power Integrated Circuits

Li Liu, Jue Wang, Zishi Wang, Miaoguang Bai, Junze Li, Zhengyun Zhu, Hongyi Xu, Na Ren, Qing Guo, Kuang Sheng
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Abstract

This paper demonstrates a SiC lateral MOSFET (LMOS) with DOUBLE RESURFs (reduce surface field) technology to improve the device's breakdown voltage. The electrical characteristics and analysis of the fabricated SiC LMOS are carried out in terms of output, transfer and blocking characteristics, as well as the leakage current mechanisms. In particular, the effect of the length of the P-top RESURFs on device performance is studied. The experimental results indicate that the SiC LMOS with P-top RESURFs of length $7\ \mu\mathrm{m}$ exhibits best comprehensively with the highest breakdown voltage of 970 V, the highest Baliga's figure of merit BFOM of 83.6MW/cm2, and low (gate) leakage current. Which is recommended in this work and also encourages its further application in the power integrated circuits (Power ICs).
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用于高压电源集成电路的4H-SiC横向MOSFET (LMOS)的电学特性与分析
本文演示了一种采用DOUBLE RESURFs(减少表面场)技术的SiC横向MOSFET (LMOS),以提高器件的击穿电压。从输出特性、转移特性和阻塞特性以及漏电流机理等方面对制备的SiC LMOS进行了电学特性分析。特别地,研究了P-top refs长度对器件性能的影响。实验结果表明,长度为$7\ \mu\mathrm{m}$的P-top RESURFs材料综合性能最好,击穿电压最高为970 V, Baliga优值bfm最高为83.6MW/cm2,漏电流小。这是本工作所推荐的,并鼓励其在功率集成电路(power ic)中的进一步应用。
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