Qi-hai Li, Wenxiao Fang, Jing Xiao, Weiming Li, W. Chen, Haimi Qiu, J. Cui, Bin Zhou
{"title":"TDR measurement of a solder under temperature cycle test","authors":"Qi-hai Li, Wenxiao Fang, Jing Xiao, Weiming Li, W. Chen, Haimi Qiu, J. Cui, Bin Zhou","doi":"10.1109/ICRMS.2016.8050115","DOIUrl":null,"url":null,"abstract":"With the decrease in the overall size and the rapid increase in the working frequencies of printed circuit boards, the reliability of solder joints, especially the high frequency signal transmission reliability has become the key factor in system reliability. In this paper, changes in RF impedance of solder joints in a temperature cycling environment was studied using time-domain reflectometry measurements. It was found that with the increase in the temperature cycle, the intermetallic compound layer gradually thickened, and even if no macro damage was found, the RF impedance increased. The transmission reliability of the high frequency signal was degraded.","PeriodicalId":347031,"journal":{"name":"2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICRMS.2016.8050115","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
With the decrease in the overall size and the rapid increase in the working frequencies of printed circuit boards, the reliability of solder joints, especially the high frequency signal transmission reliability has become the key factor in system reliability. In this paper, changes in RF impedance of solder joints in a temperature cycling environment was studied using time-domain reflectometry measurements. It was found that with the increase in the temperature cycle, the intermetallic compound layer gradually thickened, and even if no macro damage was found, the RF impedance increased. The transmission reliability of the high frequency signal was degraded.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
