High-energy Al implantation techniques for power semiconductor devices

Jai Ho Choi, K. Saito, T. Yokota, A. Watanabe
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Abstract

A high-energy Al implantation technique has been developed for the fabrication of high-power semiconductor devices. By using an implantation energy of 0.5 MeV or higher with a dosage of 1/spl times/10/sup 15/ atoms/cm/sup 2/, we obtained a p-region profile without using a film to prevent out-diffusion.
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功率半导体器件的高能铝注入技术
提出了一种用于高功率半导体器件制造的高能铝注入技术。通过使用0.5 MeV或更高的注入能量,剂量为1/spl倍/10/sup 15/原子/cm/sup 2/,我们获得了p区剖面,而无需使用薄膜来防止向外扩散。
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