{"title":"HS3DPG: Hierarchical simulation for 3D P/G network","authors":"Shuai Tao, Xiaoming Chen, Yu Wang, Yuchun Ma, Yiyu Shi, Hui Wang, Huazhong Yang","doi":"10.1109/ASPDAC.2013.6509647","DOIUrl":null,"url":null,"abstract":"As different chips are stacked together in 3D ICs, the power/ground (P/G) network simulation becomes more challenging than that of 2D cases. In this paper, we propose a hierarchical simulation method suitable for 3D P/G network (HS3DPG), which can ensure full parallelism and good scalability with the number of tiers. In the IR drop analysis, when there are 9 tiers, the hierarchical method can be 6.5 times faster than the direct full network simulation. The accuracy of HS3DPG has been verified by a 3D P/G network from the industrial design. Besides, we introduce the “locality” property into HS3DPG to further simplify the simulation. Finally, HS3DPG is used to analyze the voltage distribution of a 3D P/G network with clustered TSVs.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2013.6509647","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
As different chips are stacked together in 3D ICs, the power/ground (P/G) network simulation becomes more challenging than that of 2D cases. In this paper, we propose a hierarchical simulation method suitable for 3D P/G network (HS3DPG), which can ensure full parallelism and good scalability with the number of tiers. In the IR drop analysis, when there are 9 tiers, the hierarchical method can be 6.5 times faster than the direct full network simulation. The accuracy of HS3DPG has been verified by a 3D P/G network from the industrial design. Besides, we introduce the “locality” property into HS3DPG to further simplify the simulation. Finally, HS3DPG is used to analyze the voltage distribution of a 3D P/G network with clustered TSVs.
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