A. P. Catalano, A. Magnani, V. d’Alessandro, L. Codecasa, N. Rinaldi, B. Moser, P. Zampardi
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引用次数: 7
Abstract
This paper presents an extensive numerical analysis of the thermal behavior of InGaP/GaAs HBTs in a laminate (package) environment. The combination between the Design of Experiments technique and a fast and accurate simulation capability is adopted to quantify the impact of all the key technology parameters and explore a wide range of operating conditions.
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