FinFET for mm Wave - Technology and Circuit Design Challenges

Steven Callender, W. Shin, Hyung-Jin Lee, S. Pellerano, C. Hull
{"title":"FinFET for mm Wave - Technology and Circuit Design Challenges","authors":"Steven Callender, W. Shin, Hyung-Jin Lee, S. Pellerano, C. Hull","doi":"10.1109/BCICTS.2018.8551125","DOIUrl":null,"url":null,"abstract":"As next-generation communication systems continue to push to higher operating frequencies, one thing that has grown more uncertain is the technology node which is most suitable for implementing these systems. FinFET CMOS is a viable candidate, offering high-density and low-leakage digital transistors. However, the millimeter-wave (mmWave) capabilities of these devices remain relatively unknown by many. In this paper, we assess the mmWave performance of a FinFET process and discuss the key challenges to mmWave design in deeply-scaled technologies along with design techniques and insight to overcome such challenges. We also demonstrate the suitability of modern FinFET devices for the design of energy-efficient mmWave systems as demonstrated by a 75GHz LNA and PA implemented in Intel's 22FFL process which achieve state-of-art performance.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"89 23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BCICTS.2018.8551125","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19

Abstract

As next-generation communication systems continue to push to higher operating frequencies, one thing that has grown more uncertain is the technology node which is most suitable for implementing these systems. FinFET CMOS is a viable candidate, offering high-density and low-leakage digital transistors. However, the millimeter-wave (mmWave) capabilities of these devices remain relatively unknown by many. In this paper, we assess the mmWave performance of a FinFET process and discuss the key challenges to mmWave design in deeply-scaled technologies along with design techniques and insight to overcome such challenges. We also demonstrate the suitability of modern FinFET devices for the design of energy-efficient mmWave systems as demonstrated by a 75GHz LNA and PA implemented in Intel's 22FFL process which achieve state-of-art performance.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用于毫米波的FinFET -技术和电路设计挑战
随着下一代通信系统不断向更高的工作频率推进,越来越不确定的是最适合实现这些系统的技术节点。FinFET CMOS是一个可行的候选,提供高密度和低漏的数字晶体管。然而,这些设备的毫米波(mmWave)功能仍然相对未知。在本文中,我们评估了FinFET工艺的毫米波性能,并讨论了在深度缩放技术中毫米波设计的主要挑战,以及克服这些挑战的设计技术和见解。我们还展示了现代FinFET器件对节能毫米波系统设计的适用性,如在英特尔22FFL工艺中实现的75GHz LNA和PA,其性能达到了最先进的水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Equivalent Circuit Modelling and Parameter Extraction of GaN HEMT Gate Lag Inducing ACLR Degradation of TDD-LTE BTS PA SiGe BiCMOS Current Status and Future Trends in Europe Technology Positioning for mm Wave Applications: 130/90nm SiGe BiCMOS vs. 28nm RFCMOS Quantification of Dopant Profiles in SiGe HBT Devices Using SiGe-on-SOI HBTs to Build 300°C Capable Analog Circuits
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1