C. Ko, Kai-Ming Yang, Jim-Wein Lin, Chih-Lun Wang, T. Chou, Yu-Tao Yang, Ting-Yang Yu, Yu-Hua Chen, Kuan-Neng Chen, T. Tseng
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引用次数: 2
Abstract
In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).
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