Wafer level electromigration testing on via/line structure with a poly-heated method in comparison to standard package level tests

Abstract

In this study, we present data from alternative wafer level EM technique, poly-heated electromigration test on via chain structure. We show that there is a good correlation between conventional package level and poly-heated via test. We also present real case studies to illustrate poly-heated via test is an effective tool for process evaluation and monitoring.