Heeseok Lee, Kyoung-Min Lee, Daehan Youn, Kyojin Hwang, Junghwa Kim
{"title":"Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package","authors":"Heeseok Lee, Kyoung-Min Lee, Daehan Youn, Kyojin Hwang, Junghwa Kim","doi":"10.1109/ectc51906.2022.00096","DOIUrl":null,"url":null,"abstract":"Hybrid configuration including face-up and face-down with redistribution layer (RDL) based fan-out package (FoPKG) is presented to stack multiple dies with satisfying small form-factor requirement. In this work, authors will address that hybrid stacked die package (HSDP) solution with through silicon via (TSV) for 3D-IC as well as TSV-less configuration will be a promising solution to achieve extremely small form-factor package.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00096","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Hybrid configuration including face-up and face-down with redistribution layer (RDL) based fan-out package (FoPKG) is presented to stack multiple dies with satisfying small form-factor requirement. In this work, authors will address that hybrid stacked die package (HSDP) solution with through silicon via (TSV) for 3D-IC as well as TSV-less configuration will be a promising solution to achieve extremely small form-factor package.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
