Electrical Conductivity Development of Carbon Nanotube Filled Electrically Conductive Pates During Curing

Subaru Tsujimura, M. Inoue
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Abstract

This work discusses interfacial electrical conductivity development between fillers in carbon nanotube (CNT)-filled electrically conductive pastes during curing. Interfacial electrical properties in these pastes were successfully analyzed using impedance spectroscopy. Because the equivalent circuit analysis showed a change in interfacial capacitance during curing, binder chemistry was clarified to be one of the factors in accelerating the kinetics of the interfacial conductivity development.
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碳纳米管填充导电板固化过程中电导率的研究
本文讨论了碳纳米管填充的导电浆料在固化过程中填料之间的界面导电性发展。用阻抗谱法成功地分析了这些浆料的界面电学特性。由于等效电路分析显示了固化过程中界面电容的变化,因此明确了粘结剂化学是加速界面电导率发展动力学的因素之一。
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