C. Dover, A. Ross, S. Smith, J. Terry, A. Mount, A. Walton
{"title":"Test structures for seed layer optimisation of electroplated ferromagnetic films","authors":"C. Dover, A. Ross, S. Smith, J. Terry, A. Mount, A. Walton","doi":"10.1109/ICMTS.2018.8383766","DOIUrl":null,"url":null,"abstract":"This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.","PeriodicalId":271839,"journal":{"name":"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2018.8383766","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.
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