A. Chiariello, A. Maffucci, F. Villone, M. Nicolazzo
{"title":"Fast full-wave modeling of passive structures with graphic processors","authors":"A. Chiariello, A. Maffucci, F. Villone, M. Nicolazzo","doi":"10.1109/EPEPS.2011.6100218","DOIUrl":null,"url":null,"abstract":"A parallel computation approach based on the properties of the Graphics Processor Units (GPU) is here presented to speed-up the broadband modeling of passive 3D structures. The full-wave electromagnetic model is based on a surface integral formulation, numerically implemented by using a null-pinv decomposition of the unknowns. The numerical model has been proven to be accurate and well-posed for a frequency range from DC to hundreds of GHz. A bottleneck of the model is the assembly of fully populated matrices and the final matrix inversion. This paper presents A GPU parallelization of the matrix assembly phase, and analyzes two case-studies which refer to full-wave analysis of interconnects. The achieved speedup with respect to a conventional serial approach is around 50x.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100218","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
A parallel computation approach based on the properties of the Graphics Processor Units (GPU) is here presented to speed-up the broadband modeling of passive 3D structures. The full-wave electromagnetic model is based on a surface integral formulation, numerically implemented by using a null-pinv decomposition of the unknowns. The numerical model has been proven to be accurate and well-posed for a frequency range from DC to hundreds of GHz. A bottleneck of the model is the assembly of fully populated matrices and the final matrix inversion. This paper presents A GPU parallelization of the matrix assembly phase, and analyzes two case-studies which refer to full-wave analysis of interconnects. The achieved speedup with respect to a conventional serial approach is around 50x.