Connector interconnections to transmission lines for 40 Gb/s broadband applications

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008227

A. M. Lyons, A. Becker, Young-Min Lee, C. Metz, S.-E. Shih, P. Auernhammer, S. Weisser

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引用次数: 4

Abstract

The electrical performance of Sub-Miniature Coaxial Connector (SMCC) interconnections to transmission lines was investigated in a frequency range up to 50 GHz. A family of test coupons was built to evaluate the following design parameters of SMCC connector interfaces: transmission line structures, solder pad shapes and structures, SMCC connector structures and grounding of the SMCC housing. Electromagnetic 3D full-wave solver (HFSS) was used not only to elucidate the main design factors affecting the electrical performance of the interconnection but also to compare between model results and measured S-parameters. Low-loss SMCC interconnections to well designed Grounded Co-Planar Waveguide (GCPW) and microstrip transmission lines were achieved without significant resonances up to a frequency range of 50 GHz. Grounding between the SMCC connector housing and bottom ground plane of the transmission line was found to be the most critical factor for electrical loss. Transmission line design and connector structure details were also found to have a significant impact on performance.

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连接器连接到传输线，用于40gb /s宽带应用

在50 GHz频率范围内，研究了超小型同轴连接器(SMCC)与传输线互连的电气性能。建立了一系列测试卡，用于评估SMCC连接器接口的以下设计参数:传输线结构、焊盘形状和结构、SMCC连接器结构和SMCC外壳的接地。利用三维全波求解器(HFSS)分析了影响电网电性能的主要设计因素，并将模型结果与实测s参数进行了比较。设计良好的接地共面波导(GCPW)和微带传输线之间实现了低损耗SMCC互连，在50 GHz频率范围内没有明显的谐振。SMCC连接器外壳与传输线底接地面之间的接地是造成电损耗的最关键因素。传输线设计和连接器结构细节也被发现对性能有重大影响。

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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