MEMS failure analysis and reliability

Abstract

MEMS devices offer great potential benefits as sensors and actuators. By using and modifying the fabrication techniques originally developed for integrated circuits, microscopic devices can be formed which match or exceed the performance of their conventional counterparts in a smaller volume with lower weight and a greatly reduced cost. There are however considerable challenges in fabricating and packaging such devices and, in particular, there are many yield and reliability issues to be overcome. Some of the failure mechanisms are similar to those encountered in conventional integrated circuits while others are unique to MEMS devices. These failure mechanisms will be discussed and case studies used to illustrate some of the unique issues that need to be addressed.