Investigation of mixed SAC and SnPb solder balls under high speed ball shear and pull tests

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI:10.1109/ESIME.2009.4938414

F. Song, T. Jiang, J. Lo, S. Lee, K. Newman

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引用次数: 3

Abstract

Due to environmental consciousness and legislative regulations, Pb-free solders have been increasingly used for replacement of conventional SnPb solders in the microelectronic industry. However, during the transition period from SnPb to Pb-free solders, some products will potentially consist of mixtures of Pb-free with SnPb solders. This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching different alloys of solder balls and pastes on the OSP pad finish. The effect of thermal aging on the strength and fracture energy of the mixed solder balls during high speed ball shear/pull tests was also investigated in the study. The test specimens were aged at 125°C for durations of 200, 500 and 1000 hours. The correlations between the solder ball fracture force/energy, failure modes and intermetallic compound (IMC) thickness of the mixed alloy solder joints are also established.

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SAC和SnPb混合焊料球的高速剪切和拉伸试验研究

由于环保意识和立法规定，无铅焊料在微电子工业中越来越多地用于取代传统的SnPb焊料。然而，在从SnPb到无铅焊料的过渡期间，一些产品可能由无铅焊料和SnPb焊料的混合物组成。本文介绍了在OSP焊盘表面附着不同合金的焊锡球和膏体形成的混合焊点的显微组织分析结果。研究了热老化对混合焊料球在高速剪切/拉伸试验中强度和断裂能的影响。试件在125°C下老化200、500和1000小时。建立了混合合金焊点的焊接球断裂力/能、破坏模式与金属间化合物(IMC)厚度之间的关系。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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