Emad A. Poshtan, S. Rzepka, B. Wunderle, C. Silber, T. von Bargen, B. Michel
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引用次数: 4
Abstract
In this paper we examine the influence of different characteristics of TQFP (thin quad flat package) components on package behavior by simulation and experiment. The varied parameters are the package dimensions, rate-dependent material properties such as viscoelasticity and cure shrinkage and external boundary conditions.
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