Honglei Guo, Jingquan Liu, Zhaoyu Wang, Xingzhao Wang, Xiang Chen, Bin Yang, Chunsheng Yang
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引用次数: 2
Abstract
This paper develops a novel and simple process device based on an atmospheric pressure air microplasma jet for the selective etching of parylene-C film. In order to realize the selective etching, a quartz glass microtube (100 μm, inner diameter) is employed to generate the air microplasma jet. Experimental results demonstrated Micro-holes, micro-trenches on parylene-C film were successfully fabricated by the air microplasma jet without causing any heat damage to films and using any masks, and the etching rate reached 5.14μm/min. Due to its operating at ambient conditions, this process device can be easily integrated with roll-to-roll systems for large-scale manufacturing of flexible electronic devices in the future.
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