Lattice deformation of Sn nanowires for the application to nano-interconnection technology

Abstract

Nano-interconnection technology is expected to replace some part of solder bump technology of electronic packaging in near future. Metallic nanowires (NWs) are one of the candidates for the electrical interconnection materials. In this study, as a well-known material for the interconnection in the electronic packaging, Sn was selected for the application to nano-interconnection technology. Since the physical properties of Sn NWs are important for the interconnection applications, we have already reported the size-dependency of melting behaviors and lattice parameters of single crystalline Sn NWs. In this study, the effects of the NW microstructure and the kinds of templates, which were used for the growth of Sn NWs, on the lattice parameter were investigated. Results showed that the single crystalline Sn NWs were elongated along the longitudinal direction up to 0.64 % depending upon their microstructures and kinds of the templates. The nanowire elongation was gradually reduced when the NW microstructure were single crystalline, granular, and bamboolike structures, in sequence.