Improved Transmission Line Parameter Calculation through TCAD Process Modeling for Superconductor Integrated Circuit Interconnects

H. F. Herbst, P. Le Roux, Kyle Jackman, C. Fourie
{"title":"Improved Transmission Line Parameter Calculation through TCAD Process Modeling for Superconductor Integrated Circuit Interconnects","authors":"H. F. Herbst, P. Le Roux, Kyle Jackman, C. Fourie","doi":"10.1109/ISEC46533.2019.8990927","DOIUrl":null,"url":null,"abstract":"The FLOOXS technology CAD (TCAD) process modeling tools developed at the University of Florida have been adapted under the IARPA SuperTools program to support the MIT Lincoln Laboratory SFQ5ee fabrication process. We use FLOOXS to build meshed models of passive transmission lines from superconductor integrated circuit layouts. We have previously developed a numerical solver that extracts transmission line parameters from the meshed model. In this work, we convert a layout slice to FLOOXS inputs, generate 2D meshes of cross-sectional geometries from simulated process steps, and then extract the transmission line parameters from the meshes. Results are shown compared against the results for simplified transmission lines that do not utilize process modeling. We conclude with a discussion on the application of TCAD process modeling for parameter extraction of structures in superconductor integrated circuits beyond the device level and make a recommendation on the necessity of process modeling for high-quality parameter extraction.","PeriodicalId":250606,"journal":{"name":"2019 IEEE International Superconductive Electronics Conference (ISEC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Superconductive Electronics Conference (ISEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEC46533.2019.8990927","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

Abstract

The FLOOXS technology CAD (TCAD) process modeling tools developed at the University of Florida have been adapted under the IARPA SuperTools program to support the MIT Lincoln Laboratory SFQ5ee fabrication process. We use FLOOXS to build meshed models of passive transmission lines from superconductor integrated circuit layouts. We have previously developed a numerical solver that extracts transmission line parameters from the meshed model. In this work, we convert a layout slice to FLOOXS inputs, generate 2D meshes of cross-sectional geometries from simulated process steps, and then extract the transmission line parameters from the meshes. Results are shown compared against the results for simplified transmission lines that do not utilize process modeling. We conclude with a discussion on the application of TCAD process modeling for parameter extraction of structures in superconductor integrated circuits beyond the device level and make a recommendation on the necessity of process modeling for high-quality parameter extraction.
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利用TCAD过程建模改进超导集成电路互连传输线参数计算
佛罗里达大学开发的floxs技术CAD (TCAD)过程建模工具已根据IARPA超级工具计划进行了调整,以支持麻省理工学院林肯实验室SFQ5ee制造过程。我们使用floxs从超导集成电路布局中建立无源传输线的网格模型。我们之前已经开发了一个从网格模型中提取输电线路参数的数值求解器。在这项工作中,我们将布局切片转换为FLOOXS输入,根据模拟的工艺步骤生成横截面几何图形的二维网格,然后从中提取传输线参数。结果与不使用过程建模的简化传输线的结果进行了比较。最后讨论了TCAD工艺建模在超导体集成电路器件级以上结构参数提取中的应用,并提出了工艺建模对高质量参数提取的必要性。
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