Failure analysis of multilayer ceramic capacitor board level interconnect caused by monotonic bending stress

Abstract

Aimed at the status of low anti-bending property and relatively high failure rates of the multilayer ceramic capacitors which are widely used in the electronics industry. The board level interconnect with the typical multilayer ceramic capacitor were designed and fabricated. The effects of the monotonic bending loading on the multilayer ceramic capacitor board level interconnect were analyzed, including the physical characteristics of the failure or loss. In addition, the relationship among the monotonic bending loading conditions, the corresponding stress and strain and the physical damage was clarified, in order to provide a quantitative reference basis for the application reliability of multilayer ceramic capacitors.