Microstructural evolution of oxides during processing of oxygen implanted SOI material

S. Krause, S. Visisterngtrakul, B.F. Cordts, P. Roitman
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Abstract

Silicon-on-insulator (SOI) material fabrication by oxygen implantation (SIMOX) is addressed. Formation and growth of the buried oxide, formation and evolution of oxygen bubbles in the top silicon layer, and precipitate evolution and elimination during ramping and annealing are considered. Recent work is summarized on the effects of processing conditions on oxide evolution. Specifically, effects of implantation conditions on buried oxide formation, effects of ramping conditions on oxygen bubble evolution and defect formation, and effects of annealing conditions on the structure of the buried oxide and its interfaces are discussed.<>
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注入氧SOI材料加工过程中氧化物的微观结构演变
介绍了氧注入法(SIMOX)制备绝缘体上硅(SOI)材料的方法。考虑了埋藏氧化物的形成和生长、顶部硅层氧泡的形成和演化以及斜坡和退火过程中析出物的形成和消除。综述了近年来有关工艺条件对氧化物析出的影响的研究进展。具体地说,讨论了注入条件对埋地氧化物形成的影响,斜坡条件对氧泡演化和缺陷形成的影响,退火条件对埋地氧化物及其界面结构的影响。
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The influence of emitter efficiency on single transistor latch in silicon-on-insulator MOSFETs Low-field charge injection in SIMOX buried oxides The effect of high field stress on the capacitance/voltage characteristics of buried insulators formed by oxygen implantation Polysilicon thin film transistors with field-plate-induced drain junction for both high-voltage and low-voltage applications Persistent photoconductivity in SIMOX films
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