{"title":"Microstructural and compositional failure analysis of Cr-CrCu-Cu thin films for ball grid array (BGA) applications","authors":"N. Zhang, M. Mcnicholas, N. Colvin","doi":"10.1109/IPFA.1997.638119","DOIUrl":null,"url":null,"abstract":"A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of the Cr-CrCu-Cu multilayers and the effect of film and thermal cycle reliability were studied. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Analytical Electron Microscopy (AEM) results support the diffusion barrier relationship of CrCu layer.","PeriodicalId":159177,"journal":{"name":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.1997.638119","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of the Cr-CrCu-Cu multilayers and the effect of film and thermal cycle reliability were studied. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Analytical Electron Microscopy (AEM) results support the diffusion barrier relationship of CrCu layer.
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