10W K band GaN MMIC amplifier embedded in Waveguide-based Metal Ceramic Package

L. Marechal, B. Gerfault, G. L. Rhun, M. Dinari, T. Huet, E. Richard, V. Serru, M. Camiade, C. Chang, L. Brunel, G. Mouchon
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引用次数: 12

Abstract

This paper describes the design methodology and characterization of a 10W K Band packaged amplifier for space applications. The MMIC was developed on the new UMS $0.15 \mu\mathrm{m}$ gate length GaN technology on SiC substrate as the final stage of a downlink satellite transmitter in the 17.3-20.2 GHz frequency band. A dedicated hermetic package has been developed around the MMIC with an output waveguide transition (compatible of WR51) for low loss integration in a Solid State Power Amplifier (SSPA) output combiner. This packaged High Power Amplifier (HPA) measured in CW mode, reaches 10W output power in saturation, with an associated 35% of Power Added Efficiency (PAE) and 10° AM-PM variation. These data are provided for a package backside temperature of $90^{\circ}\mathrm{C}$.
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基于波导的金属陶瓷封装的10W K波段GaN MMIC放大器
本文介绍了一种用于空间应用的10W K波段封装放大器的设计方法和特性。MMIC是在SiC衬底上采用新的UMS $0.15 \mu\mathrm{m}$栅长GaN技术开发的,作为17.3-20.2 GHz频段下行卫星发射机的最后一级。围绕MMIC开发了专用密封封装,具有输出波导转换(与WR51兼容),可在固态功率放大器(SSPA)输出组合器中实现低损耗集成。这种封装的高功率放大器(HPA)在连续波模式下测量,在饱和状态下达到10W输出功率,附带35%的功率附加效率(PAE)和10°AM-PM变化。这些数据是在包装背面温度为$90^{\circ}\ mathm {C}$的情况下提供的。
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