Atomic Layer Deposition (ALD) Tungsten NEMS Devices via a Novel Top-Down Approach

B. Davidson, Y. Chang, D. Seghete, S. George, V. Bright
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引用次数: 8

Abstract

In this paper we present a novel low temperature, CMOS compatible, direct top-down nano-fabrication process employing ALD tungsten (WALD) as a structural material for nano-electro-mechanical systems (NEMS). Using this process doubly clamped suspended NEMS devices have been successfully fabricated and demonstrated. The devices have been observed to operate comparably to 2-terminal electrostatic carbon nanotube (CNT) switches, and MEMS tunneling devices. A lifetime in excess of 660,500 cycles has been observed under low-current-limited operating conditions. Under these conditions the device behavior is stable, reproducible and hysterisis free, resembling that of MEMS tunneling devices.
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基于自顶向下方法的原子层沉积(ALD)钨NEMS器件
在本文中,我们提出了一种新的低温,CMOS兼容,直接自上而下的纳米制造工艺,采用ALD钨(WALD)作为纳米机电系统(NEMS)的结构材料。利用该工艺已成功地制作和演示了双夹紧悬浮式NEMS器件。该器件已被观察到与2端静电碳纳米管(CNT)开关和MEMS隧道器件相媲美。在低电流限制的工作条件下,寿命超过660,500次。在这些条件下,器件行为稳定,可重复且无迟滞,类似于MEMS隧道器件。
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