Metal etch with HI-addition to conventional chemistry

W. Frank
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Abstract

The photoresist selectivity is known to increase by changing from chlorine- to bromine-based etchants. Therefore, skipping to iodine-based etchants should result in further enhancement of photoresist selectivity. This is corroborated by a very high photoresist selectivity of the iodine-based etchant HI. Since HI is also the only iodine containing compound with a sufficient vapor pressure for plasma etching, HI should be the etchant of choice for a new aluminum etch process.
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金属蚀刻与hi添加到传统化学
从氯基蚀刻剂改为溴基蚀刻剂,光刻胶的选择性增加。因此,跳至碘基蚀刻剂将导致光刻胶选择性的进一步增强。碘基蚀刻剂HI具有非常高的光刻剂选择性,证实了这一点。由于HI也是唯一的含碘化合物具有足够的蒸气压等离子蚀刻,HI应该是一个新的铝蚀刻工艺的选择。
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