Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin
{"title":"3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages","authors":"Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin","doi":"10.23919/ICEP55381.2022.9795636","DOIUrl":null,"url":null,"abstract":"Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"26 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795636","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.
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