{"title":"A versatile pick and place tool for ultraprecise placement-demonstrated by the application in an advanced MCM-D technology","authors":"P. Guide, O. Bornholdt, G. Neumann","doi":"10.1109/IEMT.1997.626874","DOIUrl":null,"url":null,"abstract":"Multichip modules for high performance applications are mostly realized in the MCM-D technology and have to satisfy a number of different requirements. Therefore new MCM-D techniques are still under development. A newly developed MCM-D approach based on chip-first technology is presented that is addressed to high-frequency systems as well as to highest interconnect densities. This development includes the set-up of a high precision pick and place tool, that allows the placing of chips with an accuracy of better than 5 /spl mu/m. The set-up and the operation of this tool are described in detail.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1997.626874","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Multichip modules for high performance applications are mostly realized in the MCM-D technology and have to satisfy a number of different requirements. Therefore new MCM-D techniques are still under development. A newly developed MCM-D approach based on chip-first technology is presented that is addressed to high-frequency systems as well as to highest interconnect densities. This development includes the set-up of a high precision pick and place tool, that allows the placing of chips with an accuracy of better than 5 /spl mu/m. The set-up and the operation of this tool are described in detail.
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