Taking the next step on advanced HKMG SOI technologies — From 32nm PD SOI volume production to 28nm FD SOI and beyond

Abstract

A foundry's mission is to deliver competitive device performance and flexibility to support a variety of SoC offerings. The restrictive lithography and process requirements at the 20nm technology limit harvesting the density and scaling benefits of the gate first approach and drive the concept change to gate last processing. This technology pushes conventional scaling to its challenging limits. Beyond 20nm new device concepts need to be employed where FinFETs and ET-SOI devices serving well candidates for new advanced CMOS technologies.