Shape Dependency of Fatigue Life in Solder Joints of Chip Resistors

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI:10.1109/ectc51906.2022.00237

J. Ha, Chongyang Cai, Pengcheng Yin, Yangyang Lai, K. Pan, Junbo Yang, Seungbae Park

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引用次数: 9

Abstract

This study is attempted to correlate between solder joint shape and fatigue life in experimental and numerical approaches. The test assemblies consisting of R1005 (1.0 × 0.5 mm) and R0402 (0.4 × 0.2 mm) soldered with SAC 305 solder material are subjected to thermal shock loading (-55 °C to 150 °C, dwell time 3 min, 6 cycles per hour). In an effort to analyze the effect of solder joint shape on fatigue life, the test assemblies are printed with different solder paste volume which induces variations in solder joint shape. The variations observed on the solder volumes generated are categorized as concave, straight, tiny convex, and convex symmetrically which are essentially achieved using stencils with different opening sizes. Another variation that is induced artificially is having unsymmetrical solder paste volume on two copper pads of a single component. Group of passive components which induces variations in solder joint shape symmetry or asymmetry are monitored to measure the resistances during thermal shock test.

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片式电阻焊点疲劳寿命的形状依赖性

本研究试图通过实验和数值方法将焊点形状与疲劳寿命联系起来。测试组件由R1005 (1.0 × 0.5 mm)和R0402 (0.4 × 0.2 mm)与SAC 305焊料焊接组成，经受热冲击载荷(-55°C至150°C，停留时间3分钟，每小时6次循环)。为了分析焊点形状对疲劳寿命的影响，在测试组件上印制不同体积的锡膏，从而引起焊点形状的变化。在生成的焊料体积上观察到的变化被分类为凹、直、微凸和对称凸，这些基本上是使用不同开口尺寸的模板实现的。另一种人为诱导的变化是在单个组件的两个铜衬垫上具有不对称的锡膏体积。在热冲击试验中，对引起焊点形状对称或不对称变化的一组无源元件进行监测，以测量其电阻。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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