Graphene-based embedded-oxide-trap memory (gEOTM) for flexible electronics application

Sung Min Kim, Sejoon Lee, E. B. Song, S. Seo, D. Seo, K. Wang
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Abstract

A The non-volatile gEOTMs are fabricated using a single-layer graphene (SLG) channel with an Al2O3 gate oxide layer, in which an ion-bombarded AlOx layer is intentionally formed by oxygen ion bombardment (OIB) to create the charge trap sites. The whole processes are carried out at temperature below 120°C to exploit gEOTM's compatibility to the flexible substrates. The devices shows a large memory window (>; 11.0 V), attributing to the effective electron-injection into the trap sites in AlOx. The results suggest that the gEOTM has potential applications for the high-density-memory devices and modules in flexible electronics.
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柔性电子应用中基于石墨烯的嵌入式氧化阱存储器(gEOTM)
非挥发性gEOTMs是用单层石墨烯(SLG)通道和Al2O3栅氧化层制备的,其中氧离子轰击(OIB)有意形成离子轰击的AlOx层,以产生电荷陷阱位点。整个过程在低于120°C的温度下进行,以利用gEOTM与柔性基板的兼容性。器件显示一个大内存窗口(>;11.0 V),这是由于电子有效地注入了AlOx的陷阱位点。结果表明,gEOTM在柔性电子领域的高密度存储器件和模块中具有潜在的应用前景。
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