A high-level timing model for variability characterization of interconnect circuits

M. Miranda, A. Papanikolaou, Hua Wang, M. Kaspiris, P. David, F. Catthoor
{"title":"A high-level timing model for variability characterization of interconnect circuits","authors":"M. Miranda, A. Papanikolaou, Hua Wang, M. Kaspiris, P. David, F. Catthoor","doi":"10.1109/DTIS.2006.1708650","DOIUrl":null,"url":null,"abstract":"At nanometer nodes (e.g., 45nm and beyond), stochastic fluctuations on the implemented features and doping levels during the processing of devices is making the electrical parameters of wires and transistors to become more unpredictable, resulting in process variability. Designers cannot neglect the impact of variability on their designs any more, not only during physical design but also during logic synthesis. They need to account for its impact on the timing of the interconnect to make sure that timing closure is achieved and that the design is manufacturable with an acceptable parametric yield. This paper presents a high-level timing model and tool for analyzing typical interconnect circuits accounting for modeling of process variability in the drivers present in the net which is fast enough to be used for Monte-Carlo variability characterization. The approach provides speed-ups between three to four orders of magnitude with very high accuracy when compared to plain SPICE simulation using a 32nn predictive technology model BSIM4 model card","PeriodicalId":399250,"journal":{"name":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIS.2006.1708650","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

At nanometer nodes (e.g., 45nm and beyond), stochastic fluctuations on the implemented features and doping levels during the processing of devices is making the electrical parameters of wires and transistors to become more unpredictable, resulting in process variability. Designers cannot neglect the impact of variability on their designs any more, not only during physical design but also during logic synthesis. They need to account for its impact on the timing of the interconnect to make sure that timing closure is achieved and that the design is manufacturable with an acceptable parametric yield. This paper presents a high-level timing model and tool for analyzing typical interconnect circuits accounting for modeling of process variability in the drivers present in the net which is fast enough to be used for Monte-Carlo variability characterization. The approach provides speed-ups between three to four orders of magnitude with very high accuracy when compared to plain SPICE simulation using a 32nn predictive technology model BSIM4 model card
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
互连电路可变性表征的高级时序模型
在纳米节点(如45nm及以上),器件加工过程中所实现的特性和掺杂水平的随机波动使得导线和晶体管的电气参数变得更加不可预测,从而导致工艺变异性。无论是在物理设计过程中,还是在逻辑综合过程中,设计师都不能再忽视变异性对设计的影响。他们需要考虑其对互连时序的影响,以确保时序闭合的实现,并确保设计在可接受的参数良率下可制造。本文提出了一个用于分析典型互连电路的高级时序模型和工具,用于对网络中存在的驱动器中的过程可变性进行建模,该模型和工具的速度足以用于蒙特卡罗可变性表征。与使用32nn预测技术模型BSIM4模型卡的普通SPICE模拟相比,该方法提供了三到四个数量级的加速,精度非常高
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Design-oriented compact models for CNTFETs Magnetic domain wall logic requires new synthesis methodologies Modeling of pixel sensors for image systems with VHDL-AMS Automated BIST-based diagnostic solution for SOPC EDP optimized synthesis scheme for Boolean read-once functions
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1