Jiahui Sun, Zheyang Zheng, Li Zhang, Yat Hon Ng, Ji Shu, Tao Chen, K. J. Chen
{"title":"Impact of Inadequate Mg Activation on Dynamic Threshold Voltage of Schottky-type $p$-GaN Gate HEMTs","authors":"Jiahui Sun, Zheyang Zheng, Li Zhang, Yat Hon Ng, Ji Shu, Tao Chen, K. J. Chen","doi":"10.1109/ISPSD57135.2023.10147398","DOIUrl":null,"url":null,"abstract":"To further reduce the forward gate current of Schottky-type <tex>$p$</tex>-GaN gate HEMTs, inadequate Mg activation in <tex>$p$</tex>-GaN is deployed in this work, which tends to convert the conventional <tex>$p$</tex>-GaN into insulating GaN with high concentration of Mg passivated by hydrogens. The free hole concentration in <tex>$p$</tex>-GaN is reduced, and so is the hole deficiency effect that is the main cause of dynamic threshold voltage (<tex>$V_{\\text{TH}}$</tex>) in commercial Schottky-type <tex>$p$</tex>-GaN gate HEMTs. However, plenty of electron traps left in <tex>$p$</tex>-GaN lead to more significant dynamic <tex>$V_{\\text{TH}}$</tex> shift (up to 6 V) under reverse gate bias (<tex>$V_{\\text{GSQ}}$</tex>, up to -13 V), as revealed by the <tex>$V_{\\text{TH}}$</tex> recovery processes under different conditions of light illumination and forward gate bias. Fortunately, under forward <tex>$V_{\\text{GSQ}}$</tex>, the fully depleted <tex>$p$</tex>-GaN layer facilitates electron acceleration by the electric field, suppressing the electron trapping and consequent dynamic <tex>$V_{\\text{TH}}$</tex> shift. Besides, deeper-level electron trapping in AlGaN may account for the slight dynamic <tex>$V_{\\text{TH}}$</tex> shift under <tex>$V_{\\text{GSQ}}\\geq 7\\mathrm{V}$</tex>.","PeriodicalId":344266,"journal":{"name":"2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD57135.2023.10147398","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
To further reduce the forward gate current of Schottky-type $p$-GaN gate HEMTs, inadequate Mg activation in $p$-GaN is deployed in this work, which tends to convert the conventional $p$-GaN into insulating GaN with high concentration of Mg passivated by hydrogens. The free hole concentration in $p$-GaN is reduced, and so is the hole deficiency effect that is the main cause of dynamic threshold voltage ($V_{\text{TH}}$) in commercial Schottky-type $p$-GaN gate HEMTs. However, plenty of electron traps left in $p$-GaN lead to more significant dynamic $V_{\text{TH}}$ shift (up to 6 V) under reverse gate bias ($V_{\text{GSQ}}$, up to -13 V), as revealed by the $V_{\text{TH}}$ recovery processes under different conditions of light illumination and forward gate bias. Fortunately, under forward $V_{\text{GSQ}}$, the fully depleted $p$-GaN layer facilitates electron acceleration by the electric field, suppressing the electron trapping and consequent dynamic $V_{\text{TH}}$ shift. Besides, deeper-level electron trapping in AlGaN may account for the slight dynamic $V_{\text{TH}}$ shift under $V_{\text{GSQ}}\geq 7\mathrm{V}$.