Microwave InAlAs/InGaAs/InP HEMTs: status and applications

P.M. Smith, P. Chao, P. Ho, K. Duh, M. Kao, J. Ballingall, S. Allen, A. Tessmer
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引用次数: 21

Abstract

The development of HEMTs based on the InAlAs/InGaAs/InP materials system for high-frequency analog applications is reported. Devices with 0.15- mu m gatelengths have demonstrated extrinsic transconductance of 1500 mS/mm and extrapolated maximum frequency of oscillation f/sub max/ greater than 450 GHz. The noise figure is the lowest of any room-temperature receiver technology over the 5 to 100 GHz frequency range. Prospects for power amplification are excellent: power-added efficiency of 41% has already been demonstrated at 60 GHz. The integration of these devices into monolithic microwave integrated circuits (MMICs) is discussed.<>
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微波 InAlAs/InGaAs/InP HEMT:现状与应用
本报告介绍了基于 InAlAs/InGaAs/InP 材料系统的 HEMT 的开发情况,这种 HEMT 可用于高频模拟应用。栅极长度为 0.15- mu m 的器件显示出 1500 mS/mm 的外在跨导和大于 450 GHz 的外推最大振荡频率 f/sub max/。在 5 至 100 GHz 频率范围内,其噪声系数是室温接收器技术中最低的。功率放大的前景非常好:在 60 千兆赫的频率下,功率附加效率已达到 41%。本文还讨论了将这些器件集成到单片微波集成电路(MMIC)中的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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