A. Ohata, S. Cristoioveanu, M. Cassé, A. Vandoorcn, F. Daugé
{"title":"Characterization of ultra-thin SOI MOSFETs by coupling effect between front and back interfaces","authors":"A. Ohata, S. Cristoioveanu, M. Cassé, A. Vandoorcn, F. Daugé","doi":"10.1109/SOI.2005.1563534","DOIUrl":null,"url":null,"abstract":"By investigating the coupling effect between the front and back channels of ultra-thin SOI-MOSFETs, the mobility enhancement by volume inversion, the channel separation between the front and back channels, and the impact of the SOI thickness are discussed. As a result, it is shown that a careful check is necessary for confirming which channel (front or back) is inverted in a short device because the channel separation is difficult in transconductance curves. Furthermore, it is shown that the SOI thickness depends on the device size and location, leading to a complex behavior.","PeriodicalId":116606,"journal":{"name":"2005 IEEE International SOI Conference Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International SOI Conference Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.2005.1563534","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
By investigating the coupling effect between the front and back channels of ultra-thin SOI-MOSFETs, the mobility enhancement by volume inversion, the channel separation between the front and back channels, and the impact of the SOI thickness are discussed. As a result, it is shown that a careful check is necessary for confirming which channel (front or back) is inverted in a short device because the channel separation is difficult in transconductance curves. Furthermore, it is shown that the SOI thickness depends on the device size and location, leading to a complex behavior.