Recent Advances in Al2O3 "In-Situ" Moisture Monitoring Chips for Cerdip Package Applications

J. B. Finn, V. Fong
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引用次数: 3

Abstract

Determination of the internal water vapor of a Cerdip package can be conveniently and inexpensively performed by an Al2O3 chip type sensor of recent design. Comparisons with an earlier design are made. Data of field trials by several IC manufacturers from common chip lots are shown. for the purpose of generating a broad range of moisture levels, both vitreous and non-vitreous sealing glass types were studied along with the effect of desiccants, lint contamination of the sealing glass, and the leak detection capability of the sensor. The relationship of sensor measured values with those of mass spectrometry is shown.
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用于Cerdip封装的Al2O3“原位”水分监测芯片的最新进展
新近设计的一种Al2O3芯片式传感器可以方便、廉价地测定Cerdip封装的内部水蒸气。并与早期设计进行了比较。显示了几家通用芯片制造商的现场试验数据。为了产生广泛的湿度水平,研究了玻璃和非玻璃密封玻璃类型以及干燥剂的影响,密封玻璃的棉绒污染以及传感器的泄漏检测能力。给出了传感器测量值与质谱测量值的关系。
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