Development of data logging system for chemical mechanical polishing and its application for process control

Abstract

Chemical mechanical polishing (CMP) has been available to semiconductor manufacturing but it is still difficult to control the CMP process precisely. This means that it is hard to control CMP according to the process model. Without model based process control, one can't achieve major success. This report describes the development of a data logging network system for CMP process. This system helps engineers building up the proper process control model. This system consists of the following equipment, CMP to which several analog/digital I/O devices were attached, the equipment of film thickness measurement and of scratch measurement, the particle measurement facility, and the infrared thermometer apparatus. All of these compose a local area network.