Soft error immune 0.46 /spl mu/m/sup 2/ SRAM cell with MIM node capacitor by 65 nm CMOS technology for ultra high speed SRAM

Soon-Moon Jung, H. Lim, W. Cho, Hoosung Cho, H. Hong, Jaehun Jeong, Sugwoo Jung, H. Park, Byoungkeun Son, Y. Jang, Kinam Kim
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引用次数: 7

Abstract

The smallest SRAM cell, 0.46 um/sup 2/, is realized by a single pitch cell layout, gate poly trim mask technique, 80 nm contact holes formed by polymer attaching process, and a 193 nm ArF lithography process. The MIM (metal-insulator-metal) node capacitor is developed and used for the first time in the SRAM cell to reduce the radiation induced soft error rate, dramatically. The high performance transistors are developed with a channel length of 70 nm, plasma nitrided 13 /spl Aring/ gate oxide, low thermal budget sidewall spacer, and CoSix.
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软误差免疫0.46 /spl mu/m/sup 2/ SRAM单元,采用65纳米CMOS技术,用于超高速SRAM
最小的SRAM单元为0.46 um/sup /,采用单间距单元布局、栅极聚修饰掩膜技术、聚合物贴附工艺形成80 nm的接触孔和193 nm的ArF光刻工艺实现。MIM(金属-绝缘体-金属)节点电容器首次应用于SRAM单元,显著降低了辐射诱发的软错误率。该高性能晶体管的通道长度为70 nm,采用等离子体氮化13 /spl Aring/栅极氧化物,低热预算侧壁间隔层和CoSix。
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