Soon-Moon Jung, H. Lim, W. Cho, Hoosung Cho, H. Hong, Jaehun Jeong, Sugwoo Jung, H. Park, Byoungkeun Son, Y. Jang, Kinam Kim
{"title":"Soft error immune 0.46 /spl mu/m/sup 2/ SRAM cell with MIM node capacitor by 65 nm CMOS technology for ultra high speed SRAM","authors":"Soon-Moon Jung, H. Lim, W. Cho, Hoosung Cho, H. Hong, Jaehun Jeong, Sugwoo Jung, H. Park, Byoungkeun Son, Y. Jang, Kinam Kim","doi":"10.1109/IEDM.2003.1269281","DOIUrl":null,"url":null,"abstract":"The smallest SRAM cell, 0.46 um/sup 2/, is realized by a single pitch cell layout, gate poly trim mask technique, 80 nm contact holes formed by polymer attaching process, and a 193 nm ArF lithography process. The MIM (metal-insulator-metal) node capacitor is developed and used for the first time in the SRAM cell to reduce the radiation induced soft error rate, dramatically. The high performance transistors are developed with a channel length of 70 nm, plasma nitrided 13 /spl Aring/ gate oxide, low thermal budget sidewall spacer, and CoSix.","PeriodicalId":344286,"journal":{"name":"IEEE International Electron Devices Meeting 2003","volume":"172 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Electron Devices Meeting 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2003.1269281","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
The smallest SRAM cell, 0.46 um/sup 2/, is realized by a single pitch cell layout, gate poly trim mask technique, 80 nm contact holes formed by polymer attaching process, and a 193 nm ArF lithography process. The MIM (metal-insulator-metal) node capacitor is developed and used for the first time in the SRAM cell to reduce the radiation induced soft error rate, dramatically. The high performance transistors are developed with a channel length of 70 nm, plasma nitrided 13 /spl Aring/ gate oxide, low thermal budget sidewall spacer, and CoSix.