I-V-T studies on ternary silicide Co/sub 1-x/Ni/sub x/Si/sub 2//n-Si Schottky contacts

Shiyang Zhu, G. Ru, X. Qu, R. Van Meirhaeghe, S. Forment, Bingzong Li
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Abstract

Ternary silicide Co/sub 1-x/Ni/sub x/Si/sub 2//n-Si(100) contacts with different x value were formed by solid phase reaction of Co/Ni bilayer and substrate Si. Their Schottky barrier properties were studied using the current voltage-temperature (I-V-T) measurements range from 100 to 300K. The I-V-T curves show three typical types, which can be related to the barrier height inhomogeneity. A clean trend is found that the barrier height inhomogeneity increases with increasing the annealing temperature. Ni incorporation reduces not only the silicidation temperature, but also the temperature at which the contact becomes inhomogeneity.
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三元硅化物Co/sub - 1-x/Ni/sub -x/ Si/sub - 2/ n-Si肖特基触点的I-V-T研究
Co/Ni双分子层与衬底Si固相反应形成不同x值的Co/sub - 1-x/Ni/sub -x/ Si/sub - 2/ n-Si三元硅化物(100)。他们的肖特基势垒特性研究使用电流电压-温度(I-V-T)测量范围从100到300K。I-V-T曲线表现出三种典型类型,这与势垒高度的不均匀性有关。随着退火温度的升高,势垒高度不均匀性有明显的增加趋势。镍的掺入不仅降低了硅化温度,而且降低了接触变得不均匀的温度。
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