Cohesive zone simulation on dynamic fracture at the interfaces of a single solder joint

Abstract

The interfacial failure behavior of a single solder joint is investigated under the pure tensile or shear loading at 5 mm/s. The brittel failure is detected for the specimen under pure tension loading, while a ductile failure is found after pure shear loading. A cohesive zone model is employed herein to explore the dynamic fracture behavior at the solder/IMC and IMC/Cu pad interfaces. The simulated results show that these two interfaces possess different mechanical properties. Under pure tensile loading at 5 mm/s, the damage typically starts at the edge of the solder/IMC interface, while the crack is eventually generated and propagated at the IMC/Cu pad interface, which corresponds to a typical brittle interfacial failure.