MOSFET stacked-pair test structure for mismatch evaluation by estimating the on-resistance ratio

Juan Pablo Martinez Brito, M. Lubaszewski, S. Bampi
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引用次数: 1

Abstract

This work describes a procedure for evaluating the mismatch between MOSFET transistors in a test array and connected as stacked-pairs. The transistor mismatch is characterized by measuring the gate voltage dependence of the DC voltage established at the middle node of the common-gate MOSFET stacked-pair. This procedure is modeled as the on-resistance ratio of these two transistors and it is performed by two simple measurements. Various pieces of information on the MOSFET mismatch characteristics (e.g., channel length variation and threshold voltage variation) can be extracted. The test structure was manufactured in 180nm CMOS technology, and the test array was designed to allow a large number of MOSFET stacked-pairs, from transistors placed in different parts of the layout to vary gradually the distance of the paired FETs.
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MOSFET叠对测试结构的失配评估,估计导通电阻比
本工作描述了一种评估测试阵列中MOSFET晶体管与堆叠对连接之间失配的程序。通过测量在共栅MOSFET堆叠对中间节点建立的直流电压对栅极电压的依赖性来表征晶体管失配。这一过程被建模为这两个晶体管的导通电阻比,并通过两个简单的测量来完成。可以提取关于MOSFET失配特性的各种信息(例如,通道长度变化和阈值电压变化)。测试结构采用180nm CMOS技术制造,测试阵列设计允许大量的MOSFET堆叠对,从晶体管放置在布局的不同部分开始,逐渐改变成对fet的距离。
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