Molecularly derived mesoscale modeling of an epoxy/Cu interface (Part IV): The effect of Filler

Abstract

Mesoscale models (parameterized from molecular models) have been previously reported [1-2] which simulate interfacial failure of both flat and rough epoxy-copper oxide interfaces, and demonstrate how coarsegrained models could be used to predict interfacial properties and mechanical failure. The work was targeted at understand molding compound failure [3-4]; however, all molding compounds are highly filled and the aspect of the filler had not yet been addressed. The current paper reports the continued efforts to explore the use of mesoscale models by adding in the effect of the filler on the mechanical response of the epoxy. This work was supported in part by the NanoInterface Consortium funded from the Seventh Framework Program for Research and Technological Development (FP7) of the European Union (NMP3-SL-20080214371).