Formation of atomically flat interface and effect of silicidation condition on Schottky contact characteristics in ErSi/sub 1.7//Si(100) system

Y. Tsuchiya, T. Irisawa, A. Yagishita, J. Koga
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Abstract

We have investigated the Schottky barrier height of ErSi/sub 1.7/ and suitable formation process to achieve the ideal interface. Atomically flat interface has been achieved by high-temperature (700/spl deg/C) furnace annealing, as well as oxide-block W-cap layer. Under this condition, Schottky barrier height value for electron of lower than 0.4 eV has been obtained. In addition, careful control of silicidation anneal is quite important to achieve ideal ErSi/sub 1.7//Si interface.
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ErSi/sub 1.7//Si(100)体系中原子平面界面的形成及硅化条件对Schottky接触特性的影响
我们研究了ErSi/sub 1.7/的肖特基势垒高度和合适的形成工艺以达到理想的界面。通过高温(700/spl℃)炉退火和氧化块w -帽层,实现了原子平面界面。在此条件下,得到了小于0.4 eV的电子的肖特基势垒高度值。此外,精心控制硅化退火对于实现理想的ErSi/sub 1.7//Si界面非常重要。
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