Fracture mechanics analysis of cracks in multilayer ceramic capacitors

Abstract

Finite element modelling of multilayer ceramic capacitors (MLCCs) is presented. The stress distribution due to thermo-mechanical loads is estimated. Thermal cool down after soldering process is considered and afterwards a three point bending test has been done. Once the critical stress regions on ceramic are estimated, a fracture mechanics analysis has been performed. Cracks are initiated and fracture parameters were estimated using a direct approach, based on the crack opening displacement and also an energy approach by calculating the J-integral parameter. Finally the fracture mechanics parameters are used for investigating the crack bifurcation.