Study on optimization of backward compatible reflow soldering process

Abstract

Due to the promotion of the globalization of environmental protection process, some high reliability requirements of electronic products have to be passive to the backward compatible soldering process. Compared to the traditional Sn-Pb soldering process, the backward compatible soldering process has to face with a smaller process window and a higher process implementation difficulty. In this paper, the technical characteristics of backward compatible reflow soldering process are studied, and the basic idea for process optimization is presented. In view of a typical product, based on the failure mechanism of product history and the present situation of reflow-soldering process, the design and implementation of the reflow soldering process optimization experiment is carried out, and the optimized process curve is obtained. The optimized results show that the quality and reliability of the optimized products meet the requirements of the investigated product.