Research of noncontact laser-based approach for DUT heating during single-event effect tests with heavy ion exposure

Abstract

A new heating approach for radiation hardness tests of the electronic components at elevated temperature is presented. Infrared laser radiation is used to increase temperature of the chip. In order to determine some practical aspects of the electronic components heating, a number of experiments for the devices in packages of different types have been performed in vacuum and in air environment. Heat transfer processes in the device structure after laser beam absorption have also been simulated using the finite element method. Application of the laser heating approach for radiation hardness assurance tests at elevated temperatures is discussed.