Insulated gate III-N devices and ICs

G. Simin, V. Adivarahan, H. Fatima, S. Saygı, A. Koudymov, X. He, W. Shuai, S. Rai, J. Yang, M. Asif Khan, A. Tarakji, J. Deng, R. Gaska, M. Shur
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引用次数: 1

Abstract

The MOSHFET design which combines the advantage of the MOS structure, which suppresses the gate leakage current, and an AlGaN/GaN heterointerface that provides high density, high mobility two-dimensional electron gas channel. This article presents a comparative review of the I-V characteristics, cut-off frequencies, RF output powers, power gain, and nonlinear distortions of AlGaN/GaN MOSHFET, and HFET device. The MOSHFETs possess significant advantages for the monolitic IC design. They sustain very high input impedance at elevated temperatures, even above 300 /spl deg/C. The results show that the MOSHFET based ICs are extremely promising for a large variety of high-power high-temperature applications.
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绝缘栅极III-N器件和集成电路
MOSHFET的设计结合了MOS结构的优点,可以抑制栅极泄漏电流,而AlGaN/GaN异质界面可以提供高密度、高迁移率的二维电子气通道。本文介绍了AlGaN/GaN MOSHFET和HFET器件的I-V特性、截止频率、射频输出功率、功率增益和非线性畸变的比较综述。在单片集成电路设计中,moshfet具有显著的优势。它们在高温下保持非常高的输入阻抗,甚至高于300 /压升度/C。结果表明,基于MOSHFET的集成电路非常有希望用于各种高功率高温应用。
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