C. Murray, P. Hogerton, T. Chheang, R. L. Rudman, H. Egeberg
{"title":"Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film","authors":"C. Murray, P. Hogerton, T. Chheang, R. L. Rudman, H. Egeberg","doi":"10.1109/ADHES.2000.860599","DOIUrl":null,"url":null,"abstract":"The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl deg/C dry, -40/spl deg/C/100/spl deg/C cycle, -55/spl deg/ C/125/spl deg/C shock, 60/spl deg/ C/95%RH and 85/spl deg/ C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl deg/C dry, -40/spl deg/C/100/spl deg/C cycle, -55/spl deg/ C/125/spl deg/C shock, 60/spl deg/ C/95%RH and 85/spl deg/ C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging.