Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

C. Murray, P. Hogerton, T. Chheang, R. L. Rudman, H. Egeberg
{"title":"Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film","authors":"C. Murray, P. Hogerton, T. Chheang, R. L. Rudman, H. Egeberg","doi":"10.1109/ADHES.2000.860599","DOIUrl":null,"url":null,"abstract":"The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl deg/C dry, -40/spl deg/C/100/spl deg/C cycle, -55/spl deg/ C/125/spl deg/C shock, 60/spl deg/ C/95%RH and 85/spl deg/ C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl deg/C dry, -40/spl deg/C/100/spl deg/C cycle, -55/spl deg/ C/125/spl deg/C shock, 60/spl deg/ C/95%RH and 85/spl deg/ C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于各向异性导电膜的亚100微米间距柔性ito /玻璃互连可靠性研究
本研究的目的是鉴定一种3M z轴(各向异性)导电膜,用于要求低于100 /spl μ m /m节距弯曲的ITO/玻璃连接。环境稳定性试验研究了加速老化条件:100/spl℃干燥、125/spl℃干燥、-40/spl℃/100/spl℃循环、-55/spl℃/125/spl℃冲击、60/spl℃/95%RH和85/spl℃/85%RH。我们检测了这些粘结剂在环境老化后的电气性能和剥离性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Electric field effects in the production of ICA joints Reliability of ACF in flip-chip with various bump heights Modeling of branched crosslinked composites, using the statistical polymer method Bismuth-filled anisotropically conductive adhesive for flip chip bonding A novel IMB technology for integrating active and passive components
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1