Microwave heating for advanced semiconductor processing

J. Booske
{"title":"Microwave heating for advanced semiconductor processing","authors":"J. Booske","doi":"10.1109/ISDRS.2003.1272185","DOIUrl":null,"url":null,"abstract":"The microwave power is successfully utilized to rapidly heat a variety of materials, including Si at 150 /spl deg/C/s to 1200 /spl deg/C and SiC at 400 /spl deg/C/s to 2000 /spl deg/C. In this paper with Si microwave RTP, we have demonstrated ultra shallow junctions that exceed lamp-based RTP capabilities and satisfy the 90 nm technology node. The comparative experiment has been conducted between microwave RTP and optical lamp RTP. Comparison sheet resistance-junction depth curve for microwave and lamp-based p-type annealing results and time-temperature profile for a high-power microwave spike annealing are studied by experiments.","PeriodicalId":369241,"journal":{"name":"International Semiconductor Device Research Symposium, 2003","volume":"180 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Semiconductor Device Research Symposium, 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISDRS.2003.1272185","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The microwave power is successfully utilized to rapidly heat a variety of materials, including Si at 150 /spl deg/C/s to 1200 /spl deg/C and SiC at 400 /spl deg/C/s to 2000 /spl deg/C. In this paper with Si microwave RTP, we have demonstrated ultra shallow junctions that exceed lamp-based RTP capabilities and satisfy the 90 nm technology node. The comparative experiment has been conducted between microwave RTP and optical lamp RTP. Comparison sheet resistance-junction depth curve for microwave and lamp-based p-type annealing results and time-temperature profile for a high-power microwave spike annealing are studied by experiments.
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用于先进半导体加工的微波加热
微波功率被成功地用于快速加热各种材料,包括硅在150 /spl°C/s至1200 /spl°C和SiC在400 /spl°C/s至2000 /spl°C。在本文中,我们用Si微波RTP展示了超浅结,超越了基于灯的RTP能力,并满足90纳米技术节点。对微波RTP和光灯RTP进行了对比实验。通过实验研究了微波和灯基p型退火的薄片电阻结深度曲线和大功率微波尖峰退火的时间-温度曲线。
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