A method to determine the frequency performance and noise margin of various interconnect technologies

Abstract

In this paper we have shown a method to evaluate various interconnect technologies by circuit simulations. Two different BGA packages with organic and ceramic substrate, mounted on conventional FR4 board are under consideration. We also have taken a configuration by using MCM interconnect where all the chips are mounted by C4 technology directly on copper polymide on ceramic substrate that has small design features, 25 micron line width and 50 micron space. We have considered the performance of the two different substrates, organic and ceramic substrates with BGA packages compared to MCM interconnect in both T and BUS design.